Event Kibum Kang
Wafer-scale growth and assembly of 2D semiconductors
High-performance semiconducting films with precisely engineered thicknesses and compositions are essential for developing next generation electronic devices, which are becoming more integrated, complex, and multifunctional. My talk will introduce the novel processes that enable atomic-scale control of the thickness and spatial composition of semiconducting films on the wafer-scale. These processes include: (i) the wafer-scale generation of monolayer van der Waals semiconductors such as transition metal dichalcogenides (TMDCs) via metal-organic chemical vapor deposition (MOCVD), (ii) the atomic-level engineering of vertical thickness and composition through the layer-by-layer assembly of TMDC monolayers, and (iii) the transfer of atomically engineered films, using their van der Waals nature, onto arbitrary substrates. These capabilities provide a new material platform for both fundamental research and practical applications, including incorporation into existing integrated circuit technology to form hybrid materials (i.e. TMDC/CMOS) and boost electrical and optical functionality.
About The Speaker
Kibum Kang is an assistant professor of Materials Science and Engineering at KAIST, South Korea. He received his B.S and PhD degree in Materials Science and Engineering from POSTECH, South Korea (2007 and 2012 respectively). After 4 years of postdoc experience in Jiwoong Park group in Cornell University and the University of Chicago (2013~2017), he joined KAIST (2018). His research focuses on investigating atomic-level engineering using metal-organic chemical vapor deposition (MOCVD) and nano/2D materials for next-generation semiconductors.